general description the max2205?ax2208 wideband (800mhz to 2ghz) power detectors are ideal for gsm/edge (max2206), tdma (max2207), and cdma (max2205/max2208) applications. the max2206/max2207/max2208 take an rf signal from a directional coupler at the input, and out- put a highly repeatable voltage. the output voltage increases monotonically with increasing input power. the output is compensated for temperature and process shifts, reducing the worst-case variation to less than ?db at full power and ?.5db at the lowest power. the max2206 features 40db dynamic range, making it ideally suited to gsm/edge applications. the max2207 offers reduced current consumption for tdma applications. the max2205/max2208 each have an inte- grated filter to allow for average power detection of cdma signals over a 25db dynamic range. the max2206/max2207/max2208 offer internal 50 ? termina- tion for interfacing with a directional coupler. the max2205 has a high-impedance input to provide a low- loss resistive tap in cdma applications. all devices allow the user to control the averaging time constant externally. the max2205?ax2208 come in a space-saving 2 ? 2, 0.5mm-pitch ucsp and require only three external components. applications dual-band gsm/edge handsets dual-band cdma/tdma handsets wcdma handsets pa modules features ? space-saving 2 ? 2 ucsp occupies only 1mm 2 ? internal temperature compensation gives ?.3db detection accuracy ? no external filter or op amp required ? power-detection range 40db (max2206) 25db (max2205/max2207/2208) max2205?ax2208 rf power detectors in ucsp ________________________________________________________________ maxim integrated products 1 top view gnd (b1) out (b2) temperature- compensated peak detector shutdown logic ucsp to adc 10k ? (max2205) 240 ? (max2206/max2207/max2208) 27pf 680 ? (max2205) 10 ? (max2206) 0 ? (max2207/max2208) 47pf from coupler/tap (max2206/max2207/max2208) shdn logic input rfin/ shdn (a1) v cc (a2) v cc c filter (optional) from pa output (max2205) max2205 max2206 max2207 max2208 pin configuration/functional diagram/typical operating circuit 19-2015; rev 6; 9/06 for pricing, delivery, and ordering information, please contact maxim/dallas direct! at 1-888-629-4642, or visit maxim? website at www.maxim-ic.com. evaluation kit available ordering information ucsp is a trademark of maxim integrated products, inc. * requires solder temperature profile described in the absolute maximum ratings section. part temp range bump-package max2205 ebs -40? to +85? 2 2 ucsp* max2205ebs+ -40? to +85? 2 2 ucsp* max2206 ebs -40? to +85? 2 2 ucsp* max2206ebs+ -40? to +85? 2 2 ucsp* max2207 ebs -40? to +85? 2 2 ucsp* max2208 ebs -40? to +85? 2 2 ucsp* max2208ebs+ -40? to +85? 2 2 ucsp* 2 ? 2 ucsp 1.01 mm ? 1.01 mm + indicates lead-free package.
max2205?ax2208 rf power detectors in ucsp 2 _______________________________________________________________________________________ absolute maximum ratings dc electrical characteristics (max2205?ax2208) (v cc = +2.7v to +5.0v, shdn = +2.0v, no rf signal applied, t a = -40? to +85?. typical values are at v cc = +2.85v and t a = +25?, unless otherwise noted.) (note 2) stresses beyond those listed under ?bsolute maximum ratings?may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specificatio ns is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. v cc to gnd ...........................................................-0.3v to +6.5v rfin/ shdn to gnd....................................-0.3v to (v cc + 0.3v) rf input power (800mhz) (max2206/max2207/max2208) .................................+20dbm rf input power (2ghz) (max2206/max2207/max2208) .................................+17dbm rf input voltage (800mhz) (max2205) ..............................1.5v p rf input voltage (2ghz) (max2205) ..................................0.8v p continuous power dissipation (t a = +70?) 2 ? 2 ucsp (derate 3.8mw/? above +70?) ............303mw operating temperature range ...........................-40? to +85? junction temperature ......................................................+150? storage temperature range .............................-65? to +160? bump temperature (soldering) (note 1) infrared (15s) (leaded)................................................+220? vapor phase (60s) (leaded)........................................+215? infrared (15s) (lead-free).............................................+260? parameter symbol conditions min typ max units supply voltage v cc 2.7 5.0 v max2206 3.5 5.5 idle supply current i idle max2205/max2207/max2208 2 3.5 ma shutdown supply current i shdn shdn = 0v 0.5 10 ? out voltage during shutdown v out shdn = 0v 0.01 v logic-high threshold v h 2.0 v logic-low threshold v l 0.6 v i ih shdn = +2.0v -1 +10 shdn input current i il shdn = +0.6v -1 +1 ? output current source capability max2206/max2207, v out = +2.5v 400 ? output current sink capability max2206/max2207, v out = 0v 300 ? ac electrical characteristics (max2205) (max2205 ev kit, v cc = +2.7v to +5.0v, shdn = +2.0v, f rf = 800mhz to 2ghz, 50 ? system, t a = -40 c to +85?. typical values are at v cc = +2.85v and t a = +25?, unless otherwise noted.) (note 2) parameter symbol conditions min typ max units rf input frequency f rf 800 2000 mhz turn-on time t on 2 s response time t r (note 3) 15 ? high input power (note 4) 0.3 1 variation due to temperature v cc = +2.85v, t a = -40 c to +85 c low input power (note 5) 1.3 2.5 db
max2205?ax2208 rf power detectors in ucsp _______________________________________________________________________________________ 3 note 1: this device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. this limit permits only the use of the solder profiles recom- mended in the industry-standard specification, jedec 020 rev. c or later, paragraph 7.6, table 3 for ir/vpr and convection reflow. preheating is required. hand or wave soldering is not allowed. note 2: specifications over t a = -40? to +85? are guaranteed by design. production tests are performed at t a = +25?. note 3: response time is taken from the time the rf signal is applied to 90% of the final value of v out . note 4: at 800mhz, output voltage is held at a value that nominally results from the final value of +31dbm input power. deviation from +31dbm is specified. at 2ghz, output voltage is held at a value that nominally results from +28dbm input power. deviation from +28dbm is specified. note 5: at 2ghz, output voltage is held 22db lower than specified in note 4. at 800mhz, output voltage is held 25db lower than spec- ified in note 4. note 6: at 800mhz, output voltage is held at a value that nominally results from +15dbm input power. deviation from +15dbm is specified. at 2ghz, output voltage is held at a value that nominally results from +13dbm input power. deviation from +13dbm is specified. note 7: for max2206, the output voltage is held at 40db lower input power than specified in note 6; for max2207/max2208, output voltage is held at a value that nominally results from 25db lower input power than specified in note 6. deviation from the nominal input power is specified. ac electrical characteristics (max2206/max2207/max2208) (max2206/max2207/max2208 ev kit, v cc = +2.7v to +5.0v, shdn = 2.0v, f rf = 800mhz to 2ghz, 50 ? system, t a = -40 c to +85?. typical values are at v cc = +2.85v and t a = +25?, unless otherwise noted.) (note 2) parameter symbol conditions min typ max units rf input frequency f rf 800 2000 mhz rf input vswr vswr 2:1 turn-on time t on 2 s max2206/max2207 300 ns response time (note 3) t r max2208 15 ? h i g h i np ut p ow er ( n ote 6) 0.3 1 variation due to temperature v cc = +2.85v, t a = -40? to +85? low i np ut p ow er ( n ote 7) 1.3 2.5 db typical operating characteristics (max2206/max2207/max2208 ev kit, t a = +25?, unless otherwise noted.) 0 0.4 0.2 0.8 0.6 1.2 1.0 1.4 1.8 1.6 2.0 -25 -15 -10 -20 -5 0 5 10 15 max2206 output voltage vs. input power max2205/06/07/08 toc01 power (dbm) output voltage (v) v cc = +2.7v to +3.5v f rf = 800mhz t a = -40 c to +85 c v cc = +3.5v t a = +85 c v cc = +2.7v t a = -40 c 0 0.4 0.2 0.8 0.6 1.0 1.2 1.4 1.6 -25 -15 -10 -20 -5 0 5 10 15 max2206 output voltage vs. input power max2205/06/07/08 toc02 power (dbm) output voltage (v) v cc = +2.7v to +3.5v f rf = 2ghz t a = -40 c to +85 c v cc = +3.5v t a = +85 c v cc = +2.7v t a = -40 c 265 270 275 280 285 290 295 300 305 310 315 320 -40 -15 10 35 60 85 max2206 response time vs. temperature max2205/06/07/08 toc03 temperature ( c) response time (ns) v cc = +2.7v v cc = +3.5v v cc = +3.0v f rf = 900mhz p in = +15dbm
max2205?ax2208 rf power detectors in ucsp 4 _______________________________________________________________________________________ 0 0.5 1.5 1.0 2.0 2.5 -10 0 -5 5 10 15 max2207/max2208 output voltage vs. input power max2205/06/07/08 toc04 power (dbm) output voltage (v) v cc = +2.7v to +3.5v f rf = 800mhz t a = -40 c to +85 c v cc = +3.5v t a = +85 c v cc = +2.7v t a = -40 c 0 0.4 0.2 1.0 0.8 0.6 1.6 1.4 1.2 1.8 -10 0 -5 5 10 15 max2207/max2208 output voltage vs. input power max2205/06/07/08 toc05 power (dbm) output voltage (v) v cc = +2.7v to +3.5v f rf = 2ghz t a = -40 c to +85 c v cc = +3.5v t a = +85 c v cc = +2.7v t a = -40 c 275 285 280 295 290 305 300 310 -40 10 -15 35 60 85 max2207 response time vs. temperature max2205/06/07/08 toc06 temperature ( c) response time (ns) f rf = 900mhz p in = +15dbm v cc = +3.5v v cc = +3.0v v cc = +2.7v 10 12 11 15 14 13 18 17 16 19 -40 10 -15 356085 max2205/max2208 response time vs. temperature max2205/06/07/08 toc07 temperature ( c) response time ( s) f rf = 900mhz p in = +15dbm (max2208) p in = +31dbm (max2205) v cc = +2.7v v cc = +3.0v v cc = +3.5v 0 0.5 1.5 1.0 2.0 2.5 616 11 21 26 31 max2205 output voltage vs. input power max2205/06/07/08 toc08 input power (dbm) output voltage (v) v cc = +2.7v to +3.5v f rf = 836mhz t a = -40 c to +85 c max2205 ev kit v cc = +3.5v t a = +85 c v cc = +2.7v t a = -40 c 0 0.3 0.2 0.1 0.5 0.4 0.6 0.7 0.8 61418 10 22 26 max2205 output voltage vs. input power max2205/06/07/08 toc09 input power (dbm) output voltage (v) v cc = +2.7v to +3.5v f rf = 1880mhz t a = -40 c to +85 c max2205 ev kit v cc = +3.5v t a = +85 c v cc = +2.7v t a = -40 c typical operating characteristics (continued) (max2206/max2207/max2208 ev kit, t a = +25?, unless otherwise noted.) pin description pin name function a1 rfin/ shdn rf input and shutdown logic input. ac-couple the rf input to this pin and apply the shutdown logic input through a resistor. drive low to turn the part off, drive high, or connect to v cc to turn the part on. a2 v cc power-supply pin. bypass to gnd with a capacitor as close to the bump as possible. b1 gnd ground connection. multiple ground vias placed as close to the ic as possible should be used to connect the ground pin to the ground plane. connect to pc board ground plane with as low inductance as possible. b2 out detector output
applications information the max2205?ax2208 have internal termination resistors for use with directional couplers. the applica- tion circuit is shown in figure 1. the output of the detector goes to an op amp in an analog gsm power- control scheme, or to an adc in other systems such as tdma or discrete-time gsm power control. the max2205 has high-input impedance for use with high-value resistive tapping from a cdma power ampli- fier. this coupling method is the lowest cost and lowest loss when used with an isolator. the application circuit is shown in figure 2. connect c filter from the max2205 output to gnd to reduce residual amplitude ripple. for is98a reverse channel signal with peak-to- avg ratio of 3.9db, a 1.5nf capacitor gives 43mv p-p rip- ple at 28dbm pa output and 390? response time. for cdma2000 (pilot + dcch) with peak-to-avg ratio of 5.4db, the ripple is about 65mv p-p at 26dbm pa output. the max2205 input impedance is listed in table 1. layout as with any rf circuit, the layout of the max2205 max2208 circuits affects performance. use a short 50 ? line at the input with multiple ground vias along the length of the line. the input capacitor and resistor should be placed as close to the ic as possible. the v cc input should be bypassed as close as possible to the ic with multiple vias connecting the capacitor to ground. refer to the max2205?ax2208 ev kit data sheet for a sample layout and details. ucsp reliability the ucsp is a unique package that greatly reduces board space compared to other packages. ucsp relia- bility is integrally linked to the user? assembly methods, circuit board material, and usage environment. the user should closely review these areas when considering using a ucsp. this form factor might not perform equally to a packaged product through traditional mechanical reliability tests. performance through operating life test and moisture resistance remains uncompromised, as it is determined primarily by the wafer-fabrication process. mechanical stress performance is a greater considera- tion for a ucsp. ucsp solder-joint contact integrity must be considered because the package is attached through direct solder contact to the user? pc board. testing done to characterize the ucsp reliability performance shows that it is capable of performing reliably through environmental stresses. results of environmental stress tests and additional usage data and recommendations are detailed in the ucsp application note, which can be found on maxim? website, www.maxim-ic.com. chip information transistor count: 344 max2205?ax2208 rf power detectors in ucsp _______________________________________________________________________________________ 5 to ant pa c filter to adc isolator/ circulator peak detector 47pf 680 ? max2205 to ant pa to adc or op amp 50 ? peak detector coupler max2206 max2207 max2208 figure 2. max2205 typical application circuit figure 1. max2206/max2207/max2208 typical application circuit
max2205?ax2208 rf power detectors in ucsp 6 _______________________________________________________________________________________ device code max2205ebs afr max2206ebs afo max2207ebs afp max2208ebs afq table 2. max2205?ax2208 device marking codes p in = -30dbm p in = +5dbm frequency (ghz) real imag real imag 0.8 189.9 -51.7 199.4 -54.0 0.9 177.3 -47.4 185.5 -49.4 1.0 165.8 -43.6 175.2 -45.7 1.1 155.2 -40.3 167.0 -42.5 1.2 146.4 -37.6 158.8 -39.8 1.3 138.8 -35.0 150.9 -37.3 1.4 131.5 -32.9 144.0 -35.1 1.5 123.3 -30.7 139.4 -33.3 1.6 115.0 -29.1 131.6 -31.8 1.7 107.2 -27.5 132.0 -30.9 1.8 110.7 -26.7 126.6 -29.3 1.9 105.3 -25.2 120.3 -27.9 2.0 94.7 -23.6 111.4 -26.7 table 1. max2205 input impedance (r || jx, pc board de-embedded)
maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circu it patent licenses are implied. maxim reserves the right to change the circuitry and specifications without notice at any time. maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 _____________________ 7 2006 maxim integrated products is a registered trademark of maxim integrated products, inc. max2205?ax2208 rf power detectors in ucsp 4l, ucsp 2x2.eps g 1 1 21-0117 package outline, 2x2 ucsp package information (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/packages .) revision history pages changed at rev 6: 1, 2, 3, 7
english ? ???? ? ??? ? ??? what's new products solutions design appnotes support buy company members max2205 part number table notes: see the max2205 quickview data sheet for further information on this product family or download the max2205 full data sheet (pdf, 144kb). 1. other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales . 2. didn't find what you need? ask our applications engineers. expert assistance in finding parts, usually within one business day. 3. part number suffixes: t or t&r = tape and reel; + = rohs/lead-free; # = rohs/lead-exempt. more: see full data sheet or part naming conventions . 4. * some packages have variations, listed on the drawing. "pkgcode/variation" tells which variation the product uses. 5. part number free sample buy direct package: type pins size drawing code/var * temp rohs/lead-free? materials analysis max2205ebs+ ucsp;4 pin; dwg: 21-0117g (pdf) use pkgcode/variation: b4+4 * 0c to +70c rohs/lead-free: yes materials analysis max2205ebs ucsp;4 pin; dwg: 21-0117g (pdf) use pkgcode/variation: b4-4 * -40c to +85c rohs/lead-free: no materials analysis max2205ebs+t10 ucsp;4 pin; dwg: 21-0117g (pdf) use pkgcode/variation: b4+4 * 0c to +70c rohs/lead-free: yes materials analysis
max2205ebs-t ucsp;4 pin; dwg: 21-0117g (pdf) use pkgcode/variation: b4-4 * -40c to +85c rohs/lead-free: no materials analysis max2205ebs-t10 ucsp;4 pin; dwg: 21-0117g (pdf) use pkgcode/variation: b4-4 * -40c to +85c rohs/lead-free: no materials analysis max2205ebs+t ucsp;4 pin; dwg: 21-0117g (pdf) use pkgcode/variation: b4+4 * -40c to +85c rohs/lead-free: yes materials analysis didn't find what you need? contact us: send us an email copyright 2007 by maxim integrated products, dallas semiconductor ? legal notices ? privacy policy
|
